The Computational Fluid Dynamics (CFD) modeling of light emitting diode (LED) components has become increasingly more important as it is now being applied to the design process. This paper compares ...

ANSAN, South Korea--(BUSINESS WIRE)--Seoul Semiconductor Co., Ltd. (KOSDAQ 046890), a leading global innovator of LED products and technology, announced that it has introduced high-power LED package ...

Designed for sensing applications in portable consumer devices as well as noncontact position sensors, machine automation systems, and miniature optical encoders, OP200 series infrared LEDs deliver ...

High current density, very low thermal resistance and low-profile mean that lighting equipment manufacturers can increase brightness while reducing system size Flat LED package for easy integration ...

OSRAM Opto Semiconductors now offers the Advanced Power TOPLED line of LEDs incorporating the company’s ThinFilm technology. These new products broaden OSRAM's high-power, surface-mount LED product ...

Power Integrations announced the availability of LinkSwitch-PH LED driver ICs in a low-profile eSIP-7F (L package) that measures just 2 mm high. Power Integrations announced the availability of ...

LuxLEDs combine high-level illumination with low-power consumption and are available in three different surface-mounted packages. Axial intensities are as high as 24,000 mcd with flux levels to 120 mA ...