The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

The patched issues span core standard library components including archive/zip and net/http, as well as security-sensitive ...

A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...

As the AI ​​boom causes DDR5 shortage and high prices, PC builders are reviving 19-year-old DDR3 memory tech to stay under ...

The landscape of blockchain engineering is evolving at a breakneck pace. For many aspiring developers, the prospect of ...

Forget inflation. The AI ​​DRAM (memory) chip crisis is causing "RAM shrinkflation," with smartphone prices increasing in ...

Quectel has introduced its SH602HA-AP computing module aimed at powering robotic devices, for example humanoid robots, wheel-arm robots, quadruped robots, or service companion robots.

Workload consolidation has massive benefits, but implementation concerns have held back OEMs. Pre-integrated hardware and ...

The lack of GeForce RTX 50-series “Blackwell” SUPER announcements at CES 2026 has fueled new speculation that NVIDIA’s ...

Lanner Electronics, a developer of rugged Edge artificial intelligence (AI) hardware, has launched the EAI-I351, a robotic AI ...

A newly discovered vulnerability in AMD chips allows malicious actors to perform remote code execution (RCE) and privilege ...

Explore how the Zero Knowledge Proof project uses the Substrate framework and modular pallets to build a secure, ...